Powering the next era of computing.
Building a U.S.-based platform connecting high-end IC substrates, advanced semiconductor packaging, test, reliability, and new product introduction.
Building a stronger semiconductor future.
Axiomera Technologies is being developed as an independent U.S. advanced packaging and high-end IC substrate platform, bringing together industrial expertise from Tongfu Microelectronics and AT&S. The initiative is designed to strengthen domestic engineering responsiveness, supply-chain resilience, and high-value manufacturing for demanding next-generation applications.
Built for the U.S. market
Developing localized leadership, engineering, manufacturing, quality, supply-chain, and customer-service capabilities.
One connected platform
Connecting substrate technology, advanced packaging, reliability, and customer co-engineering from NPI to production ramp.
Designed to scale
Prioritizing automation, process yield, equipment efficiency, digital manufacturing, and disciplined capital deployment.
Engineering the connection
between silicon and systems.
Our planned platform brings complementary technologies together to support complex computing requirements.
High-End IC Substrates
Advanced interconnect, FC-BGA substrates, materials engineering, and next-generation substrate architectures.
Advanced Packaging
Flip-Chip, SiP, heterogeneous integration, and a development path toward 2.5D and Chiplet packaging.
Test & Reliability
Advanced testing, reliability validation, failure analysis, and customer qualification systems.
New Product Introduction
Process development, equipment qualification, samples, and a structured transition to high-volume manufacturing.
Manufacturing Excellence
Automation, SPC/APC, root-cause analysis, equipment productivity, and yield improvement.
Materials & Thermal
Advanced materials, high-speed interconnect, and thermal-management integration for demanding applications.
A focused path from launch to next-generation integration.
Capabilities will be developed in phases, aligned with customer requirements, technical maturity, and manufacturability.
Establish the Foundation
FC-BGA substrates, Flip-Chip, SiP, advanced test, and reliability.
Advance Integration
2.5D / Chiplet integration, large-format packaging, advanced substrates, and thermal integration.
Enable the Next Generation
Glass-core substrates, advanced embedding, and emerging substrate and packaging capabilities.
Complementary strengths.
One U.S. vision.
Axiomera's planned platform combines expertise in scaled advanced packaging and test with high-end IC substrate technology and materials engineering.
Tongfu Microelectronics
Advanced packaging and test operations, manufacturing scale-up, equipment introduction, yield improvement, and global customer delivery.
AT&S
High-end IC substrates, advanced interconnect, materials engineering, substrate R&D, and high-performance computing applications.
The project is in its development and build-out phase. References to technologies and operations describe the planned platform and partner capabilities, not a claim that every capability is currently in commercial operation.
More than a factory.
From engineering to volume
Bringing together equipment qualification, process development, reliability, customer qualification, yield ramp, and capacity expansion.
Resilience by design
Developing U.S. supply-chain capabilities, qualified sourcing, digital operations, and disciplined quality systems.
Intelligent production
Emphasizing automation, machine vision, data engineering, process control, and equipment efficiency.
Built with experienced teams
Recruiting leaders and technical professionals who can shape new organizations, systems, and manufacturing capabilities.
Help build what comes next.
We are building the core leadership and technical teams for a U.S. advanced packaging and substrate platform. This is an opportunity to shape capabilities from the ground up.
Engineering. Manufacturing. Quality. Leadership.
We welcome conversations with experienced professionals in advanced packaging, IC substrates, NPI, equipment engineering, quality, reliability, supply chain, operations, digital manufacturing, and commercial leadership.
Contact Talent Acquisition →Please include your area of expertise and a brief professional introduction. No positions or employment terms are guaranteed by this website.
Let's build the future together.
For career inquiries and professional introductions, reach out to our U.S. recruitment contact.
zhou-hr@axiomeratechnologies.com ↗
Location: Texas, United States · Final facility site under development
Send an Email →